Product description
Silicone Potting Compound 037 is a modern, two-component, addition-curing material specifically developed for protecting and encapsulating electronic parts, such as mechanical parts, components, cables, and PCBs, intended for enclosures for potting. Its high transparency enables efficient light transmission, making it suitable for embedding LEDs and LED modules. The compound enables hermetic sealing and protects sensitive components, circuit boards, and modules from external influences such as vibrations and moisture. Once cured, the compound forms a hard, transparent, rubber-like material.
Key Properties:
- UV Resistance: Does not yellow under UV exposure, maintains crystal-clear transparency over time.
- Electrical Insulation: After curing, it forms a layer with high electrical resistivity, providing effective protection against overvoltage and short circuits.
- Temperature Range: Withstands extreme temperatures, from -50 °C to +180 °C. Suitable for both indoor and outdoor applications.
- Dielectric Strength: With a value of 11 kV/mm, the product offers high breakdown resistance, making it suitable for high-voltage applications.
Ease of Use and Preparation:
- Surface Preparation: Components, circuit boards, and cables to be encapsulated should be cleaned and degreased with isopropanol prior to casting.
- Mixing: The product consists of two components to be mixed together.
- Curing: Standard curing takes approximately 24 hours at room temperature. The process can be accelerated to 6 hours at 70 °C.
Specifications:
- Viscosity (pre-cure): 2500 ± 500 cP ? allows for easy dispensing and potting.
- Hardness (post-cure): 12 Shore A ? provides flexibility and vibration damping.
- Dielectric Constant: 3.19 at 120 Hz ? ensures high insulation performance.
- Creep Resistance: CTI value of 600 V ? offers protection against electrical tracking.
