Product description
Solder Paste Easy Print, Sn/Ag/Cu 6g. Lead-free solder paste for SMD soldering. Easy Print is a homogeneous, ready-to-use mixture of metal powder, binder, solvent, and flux. The paste has excellent wetting properties and is well-suited for soldering temperature-sensitive components. Easy Print offers a long open time and leaves transparent flux residues. Shelf life: approximately 6 months. Extended when stored refrigerated.
Easy Print is ideal for both prototyping and industrial production, as well as for professional service workshops.
Properties:
- High purity: Contains 96.5% tin, 3% silver, and 0.5% copper.
- No-clean type: Leaves no residues that require cleaning after soldering. Any remaining residues can be removed with isopropanol if necessary.
- Prevents “Mid-Chip Solderballing”: Ensures high soldering quality and minimizes the risk of defects.
- Excellent adhesion: Provides strong electrical and mechanical contact even after 20 hours from application.
Usage:
- Ensure the device is de-energized before application.
- Apply the paste directly to solder pads or by using a stencil.
- Recommended printing speed: up to 150 mm/s.
- Use in a well-ventilated area. Avoid inhalation of fumes.
- Read the safety data sheet carefully before use.
Warning:
Contains: Colophony and 1,2-bis(2-methoxyethoxy)ethane
Hazard statements:
H317 – May cause an allergic skin reaction.
H360Df – May damage the unborn child. Suspected of damaging fertility.
Precautionary statements:
P102 – Keep out of reach of children.
P201 – Obtain special instructions before use.
P261 – Avoid breathing dust/fume/gas/mist/vapours/spray.
P280 – Wear protective gloves/protective clothing/eye protection/face protection.
P308 + P313 – If exposed or concerned: Get medical advice/attention.
P333 + P313 – If skin irritation or rash occurs: Get medical advice/attention.
P362 + P364 – Take off contaminated clothing and wash it before reuse.
P501 – Dispose of contents/container to an approved waste disposal facility.
