Product description
Lead-free solder paste for SMD soldering. Reflow temperature: >219° C. It is a homogeneous, ready-to-use, odourless mixture of metal powder, binder, solvent and flux. The paste has excellent wetting properties and is suitable for soldering temperature sensitive components. Store in a refrigerator (3-7°C). Suitable applicationtemperature: 23-26 °C). Composition: Sn96.5/Ag3.0/Cu0.5.
Read the safety data sheet before use.
Warning / Hazard:
H317: May cause an allergic skin reaction
H360Df: – May damage the unborn child. Suspected of damaging fertility
Skyddsangivelser:
P308+313: IF exposed or concerne: Get medical advice/attention
P261: Avoid breathing dust/fume/gas/mist/vapours/ spray
P280: Wear protective gloves / protective clothing / eye protection
P333 + P313: If skin irritation or rash occurs: Get medical advice/attention.
P362: Take off contaminated clothing. Wash contaminated clothing before reuse
P501: Dispose of contents/container to recycling centre
