Product description
Lead-free solder with diameter 0.6 mm. The tin has channels with no-clean type flux. No-clean means that very little spattering and flux residues occur during soldering. It also means that any residues are transparent, non-corrosive and non-corrosive. Composition: 99.3% tin (Sn) and 0.7% copper (Cu). Melting temperature 227°C.
