Thermal conductive silicone pad TO-3 0.38K/W

Thermally conductive interface pad that can be used as a replacement for mica insulators and thermal grease to transfer heat from a semiconductor device to the heatsink. Electrically insulating.

Specifications:

• For package: TO-3
• Thermal resistance: 0.38 K/W
• Dimensions: 42 x 29 mm
• Thickness: 0.3 mm
• Mounting hole: ø4 mm
• Operating temperature range: -50 °C to +180 °C
• Dielectric strength (max): 6kV