Product description
AG ThermoPad is a high-performance thermal conductive foil/pad with excellent thermal properties. It is designed for easy application between heat sink and semiconductor, featuring a double-sided adhesive surface for secure mounting. Easily cut to the desired size. Package contains 1 pc.
Features:
- Excellent thermal conductivity
- Electrically insulating with high dielectric strength
- Replaces mechanical fasteners
- Outstanding adhesion properties, double-sided adhesive surface
- Simple and secure attachment of components such as heat sinks to electronic devices
Applications:
- Between semiconductors and heat sinks: Provides optimal thermal interface and efficient heat transfer.
- Filling air gaps: Excellent as a thermal interface material and gap filler.
- LED lighting systems: Ensures stable operating temperatures, prolonging LED lifespan.
Specifications:
- Thickness: 1.0 mm
- Dimensions: 30 × 30 mm
- Thermal conductivity: 6 W/mK
- Operating temperature range: -60 °C to +200 °C
- Package contains: 1 pc
