Product description
Thermal Paste Type HPX ? 7 g Tube with Thermally Conductive Paste
Reduces thermal contact resistance between semiconductors and heat sinks. Recommended where an efficient and reliable thermal connection of electronic components is required.
Properties:
Electrically non-conductive, wide temperature range, and high thermal conductivity. The paste?s unique formulation is resistant to chemicals and high temperatures. Combined with excellent electrical insulation properties, this makes the paste an ideal solution for a wide range of applications.
HPX cooling paste is chemically neutral, making it safe to use on most materials, including plastics and metals. It provides long-lasting protection and stability across a broad temperature range.
Specifications:
- Thermal conductivity: >2.8 W/mK
- High temperature resistance
- Resistant to oxidation, aqueous solutions, acids, bases, salts, sulfur dioxide, and ammonia
- Excellent dielectric properties
- Versatile use
- Easy application
- Appearance: Grey paste
- Density at 20 °C: 2.0 g/cm³
- Operating temperature range: ?50 °C to +250 °C
- Viscosity: Paste, non-liquid
Example Applications:
- Modules with high thermal conductivity
- Devices mounted on heat sinks
- Power converters, communication equipment
- Processors (CPU and GPU)
- High-power LEDs
Warning:
Contains: Zinc oxide and silicon carbide
Hazard Statements:
-
H410 ? Very toxic to aquatic life with long lasting effects.
Precautionary Statements:
- P102 ? Keep out of reach of children.
- P273 ? Avoid release to the environment.
- P501 ? Dispose of contents/container to an approved waste collection point.
