Product description
High-Performance Heat-Conductive Silver Thermal Paste for CPU and GPU, syringe. One syringe is sufficient for application to approximately 8 larger CPUs. Features low thermal resistance and high thermal conductivity. Reduces thermal interface resistance between semiconductors and heat sinks. Recommended where efficient and reliable thermal coupling of semiconductor components is required.
Properties:
Electrically non-conductive, wide operating temperature range, and high thermal conductivity. The silver paste is chemically neutral with excellent electrical insulation properties (500 V/mm). Provides long-lasting protection and stability across a broad temperature range.
Specifications:
- Thermal conductivity: >3.8 W/mK
- High temperature resistance
- Excellent dielectric properties
- Compatible materials: Aluminium, copper, ceramic, etc.
- Easy application
- Appearance: Grey-silver
- Density at 20 °C: 2.37 g/cm³
- Operating temperature range: -50 °C to +250 °C
- Viscosity: Paste, non-liquid
Examples of Applications:
- Processors (CPU and GPU)
- High heat conductivity modules
- Devices mounted on heat sinks
- Power converters, communication equipment
- High-efficiency LEDs
Tip: To remove old thermal paste from processors and heat sinks, use a cotton cloth or lint-free paper moistened with isopropyl alcohol.
Warning:
Contains: Zinc oxide and silver
Hazard Statements:
-
H410 Very toxic to aquatic life with long lasting effects.
Precautionary Statements:
- P102 Keep out of reach of children.
- P273 Avoid release to the environment.
- P501 Dispose of contents/container in accordance with local/regional/national/international regulation.
